发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the corrosion of wiring by a method wherein an opening part is formed on a final passivation film, and alluminum nickel alloy is cladded to this opening. CONSTITUTION:A pellet 3 is attached to a tab 1 interposing a blazing material such as gold-silicon eutectic crystals etc. A wiring 9 and a final passivation film 8 are provided on the pellet 3. The opening part 10 is formed by etching at the determined position of the film 8, and a part of the wiring 9 is exposed. Aluminum-nickel alloy is cladded at the opening part 10 at the condition the surrounding of said alloy is extended on the upper surface of the film 8.
申请公布号 JPS6122659(A) 申请公布日期 1986.01.31
申请号 JP19840142342 申请日期 1984.07.11
申请人 HITACHI SEISAKUSHO KK 发明人 KEIDA HARUO
分类号 H01L21/60;H01L23/485 主分类号 H01L21/60
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