| 摘要 |
A method for producing multiplane circuit boards in which a plurality of planar members, each having a plurality of connecting areas disposed in rows on the planar member, each connecting area having interlinking positions and interrupting positions, with such positions in predetermined locations, are prepared. A plurality of planar members, each having trains of conductors in parallel paths at predetermined locations are also prepared. Such planar members are then stacked, one on the other, with the connecting areas and conducting paths in predetermined position and the stacked planar members are then laminated together. Selected of the interlinking positions and selected of the interrupting positions are then interconnected by drilling the laminate to form the multiplane circuit board. |
