| 摘要 |
PURPOSE:To eliminate the generation of recesses and projections on the surface of an IC card by providing a sheet of thermoplastic synthetic resin to an IC module attachment part of a center core sheet and applying heat and pressure to fuse said resin sheet and to fill the recesses. CONSTITUTION:An IC module 11 is attached to a center core sheet 1 made of the thermoplastic synthetic resin of polyvinyl chloride, etc. Then a thermoplastic synthetic resin sheet 21 having a plane size larger than a pierced hole 2 together with about 200mum thickness is put on the attachment part of the module 11. Under such conditions, the sheet 1 is heated and pressed together with the sheet 21 from both upper and lower sides by a pair of heat/pressure plates. Thus both sheets 1 and 21 are fused and the sheet 21 fills the gaps produced on the surfaces of both the sheet 1 and the module 11 and also cuts into the surface of the sheet 1. Thus the surface of the sheet 1 is smoothed. While the sheet 1 encloses the peripheral part of a printed base board 12. Furthermore oversheets 31 and 31 printed on their rear sides respectively are set on both sides of the sheet 1 and adhered when necessary. |
