| 摘要 |
PURPOSE:To prevent the generation of crystal lattice defects such as cracks by a method wherein the titled device is equipped with a means of cleaning the surface of a mount for holding a semiconductor substrate by adsorption before mounting a semiconductor substrate. CONSTITUTION:When the mount with a semiconductor substrate held by adsorption descends, the hard substrate 3 reciprocates at a time while being cleaned with a rotary brush 8 by means of a mechanism 7 for moving hard substrates. At this time, dusts such as projection segments dropped from the hard substrate 3 by means of the rotary brush 8 are removed outside the device through the exhaust port 9 of the hard substrate cleaning section. The mount 2 is scanned with a jet.nozzle 10 for dust removal. The dusts such as projection segments scattering on the substrate and on the mount 2 in the periphery of the substrate are led to the exhaust port 12 for the mount part and then removed outside the device. Next, the substrate is carried out, and the mount 2 is scanned again with the jet.nozzle 10 for dust removal, thus removing the dusts such as projection segments remaining in the same manner from the mount 2. |
