| 摘要 |
PURPOSE:To increase the mounting density and shorten the wiring length by a method wherein the end of a semiconductor chip is provided with a terminal, and a plurality of which terminals are arranged on other semiconductor chips at the same time. CONSTITUTION:One end surface of each semiconductor chips 301-304 is provided with mounting projections a, b; then, these projection are inserted into recesses provided in a wiring semiconductor chip 305, thus fixing both. A groove 306 similar to the appearance of the semiconductor chips 301-304 is formed, and the semiconductor chip 301 is fixed in this groove. The side surface of the top of the case 307 is provided with a connection terminal 311: this terminal is bent in L shape and connected to the internal wiring of the wiring chip 305 via facedown bonding 312 provided on the chip 305, and is connected to lead terminals 310 from the chip 301 via connection pad 309 provided on the chip 305. |
