| 摘要 |
PURPOSE:To obtain the titled device excellent in moisture resistance by strengthening the adhesion with the sealing resin by a method wherein a lead frame is treated with primer after satining by surface treatment with an etchant. CONSTITUTION:The etching treatment for the surface of lead frames is treatment with copper oxide by dipping in an alkaline solution in the case of copper of lead material, and coarsing treatment with a mixed solution of FeCl3+HCl in the case of 42 alloy. The resin comes to intrude into leads by forming many unevennesses in the lead surface, and sliding becomes difficult to occur. Besides, the resin becomes easier in intrusion because the surface formed by etching treatment is acicular, and the effect is much larger than the method of physical polishing. Further, the etching surface is treated with primer with a coupling agent or the like, thereby improving the adhesion of the lead frame with the resin. |
