| 摘要 |
A hybrid or printed circuit is formed on a substrate (1) which comprises an iron-chromium-aluminum alloy which may also contain Yttrium and which forms a stable inert strongly adhering ceramic layer (5,6) on its exposed surfaces when heated in an oxidizing atmosphere in order to produce a hybrid circuit a dielectric paste is printed on the ceramic surface (5) of the alloy to form a platform (9). Conductors (10,11) are then printed on the dielectric platform (9) and fired. One or more component(s) (8) is/are then soldered to the conductors. |
