| 摘要 |
PURPOSE:To eliminate the need to detect or correct bonding positions for every circuit substrate by a method wherein at least a mark position provided in a circuit substrate is detected, thereby correcting the bonding positions of a plurality of circuit substrates. CONSTITUTION:An ITV camera 14 picks up images of a mark 19 of a circuit substrate 18a on one side of a frame 6 and a mark 19 of a circuit substrate 18f on the other side. This image pickup signal is inputted in a comparing correction part 15, thus detecting the positions of the two marks 19 in X and Y directions; then, this detection signal is compared with reference patterns inputted from a pattern memory 17 to the comparing correction part 15. Thereby, the amount of shift of bonding positions in the X and Y directions of all the circuit substrates 18a-18f formed to the frame 6 is obtained by the comparing correction part 15. Output signals corresponding to the amount of shift are outputted to a driving part 16, and an X-Y table 5 is driven by this driving part 16. |
