| 摘要 |
PURPOSE:To increase the strength of junction between connecting leads and wires by providing a heating device for heating the neighborhood of the tip of a capillery and the wire fed out of the capillary. CONSTITUTION:Inside the heating part 7B of the heating device 7, an inert gas introduced there is heated to about 300 deg.C by a cartridge heater 7b, and the heated inert gas is sprayed out of a gas nozzle 7A toward the neighborhood of the tip of the capillary 1 and heats the tip of the capillery and the tip of the bonding wire projecting out of it. When the capillery 1 is put in positioning to a required electrode pad of a semiconductor chip C, the capillery descends and presses the electrode pad in the state that a ball is formed at the tip of the bonding wire by heating electrodes 2, and at the same time the ball at the tip of the bonding wire is welded by pressure with supersonic oscillation given from a supersonic oscillator 4 to the capillary 1. |
