发明名称 |
Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
摘要 |
Two bodies such as an integrated circuit and a heat sink are maintained in a low stress and high thermal conductance abutment by pressure from capillary attraction. A surface of one of the bodies is provided with grooves preferably having reentrant surfaces. A surface of the other body is brought into abutment with the grooved surface with a liquid therebetween which partially fills the grooves. The grooves act as reservoirs for excess liquid so that a minimum thickness liquid interface is achieved, and the grooves enable trapped gas to escape out the open ends thereby preventing voids between the two bodies. Importantly, the groove geometry enforces a well-defined attractive force between the two surfaces due to the liquid surface tension.
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申请公布号 |
US4567505(A) |
申请公布日期 |
1986.01.28 |
申请号 |
US19830546158 |
申请日期 |
1983.10.27 |
申请人 |
THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY |
发明人 |
PEASE, ROGER F.;TUCKERMAN, DAVID B.;SWANSON, RICHARD M. |
分类号 |
H01L21/58;H01L23/367;H01L23/373;(IPC1-7):H01L23/36 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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