| 摘要 |
PURPOSE:To eliminate a disconnection of a glass paste at the parts of the shoulders and to prevent the shoulders from exposing by a method wherein the device is made into a structure, wherein a flat glass coating is performed ranging from the end parts of the upper face of the semiconductor to the surfaces of the mesa-shaped junction parts of the semiconductor. CONSTITUTION:A P type layer 1 is diffused on an N type substrate 2, and after that, a mesa etching is performed on the prescribed places. Then, the first printing of a glass paste 3 is performed on the mesa etching parts in the depth and width thereof using a printing technique. In this case, the glass paste shall be one that powdered glass is dispersed in an organic binder and the glass is being formed in a pasty form. The paste at the mesa etching parts is flattened at the same level with the upper face of the layer 1 and a glass sintering is performed using a drying technique and a sintering technique. A glass paste 4 of the desired width as wide as to cover the mesa etching parts is further printed on the mesa etching parts. As a result, this semiconductor device is structurally made into such a constitution that a glass paste is filled in the mesa etching parts at the same level with the upper face of the semiconductor and the parts of the shoulders are further covered with a glass paste. According to this way, the parts of the shoulders in a mesa form never become thinner and are never exposed, and a glass coating can be uniformly performed. |
