发明名称 PROCESSO E STRUTTURA PER LA CONNESSIONE DI CIRCUITI ELETTRICI
摘要 Surface connections of electrical component leads to circuit substrate lands are made with split sleeves on the lead ends, adjusted for contact with the lands, and soldered in position to join leads, sleeves, and lands.
申请公布号 IT1114870(B) 申请公布日期 1986.01.27
申请号 IT19770024191 申请日期 1977.05.31
申请人 IBM CORP 发明人
分类号 H05K1/11;H01L23/50;H01R4/02;H05K1/18;H05K3/34 主分类号 H05K1/11
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