| 摘要 |
<p>PURPOSE:To improve humidity proof characteristic after soldering by utilizing an epoxy resin forming material including hardening or solidifying element in the post-hardening process. CONSTITUTION:There are hydrocarbon system polymers such as polyethylene, polypropylene, polyorephine including halogen, polybutadiene and polyisoplane and unsaturated polyester resin and silicon resin such as ethylenegricol maleate polymer as the element which does not easily dissolve into the epoxy resin and hardening agent and particularly is hardened or solidified in the post hardening process. Such elements is not hardened or solidified at the molding sealing process for semiconductor device but hardened or solidified in the post-hardening process at the interface of hardened epoxy resin, semiconductor element and lead frame. Therefore, deterioration of humidity proof characteristic after soldering at the semiconductor device can be prevented.</p> |
