| 摘要 |
PURPOSE:To realize cooling of semiconductor chip at the surface and improve cooling efficiency by providing a fluid cooling apparatus which is freely compressed with a pressure of cooling medium. CONSTITUTION:A fluid cooling apparatus which cools semiconductor chips 2 and loading substrates 1 is mainly composed of a cooling medium supply port 5A, a cooling medium exhaust port 5B, a sealing cap for sealing a cooling medium, a semiconductor chip cooling part 6A which is freely compressible with a pressure of cooling medium and a cooling member 6 consisting of a loading substrate 6B and bellows 6C. The cooling medium is perfectly sealed by the loading substrate 1 and the cooling member 6 and these are separated from direct contact with the semiconductor chip 2. Moreover, in view of improving the cooling efficiency, an adequate amount of high heat conductive gel or high heat conductive gas may be supplied to the semiconductor chip 2 which is perfectly sealed by the cooling member 6 and the loading substrate 1. |
