| 摘要 |
The invention provides a device for distributing electric potentials for supplying a component with electric power, capable of being incorporated in the case in which the component is encapsulated. This device is in the form of a plate comprising conducting planes connected to external power supply potentials. This plate either forms the cover of the case or is placed inside the case above said component. Each of the conducting planes of the device is connected, outside the case, to the power supply potential and, inside the case, at multiple points to the component so as to distribute these potentials to the appropriate inputs/outputs thereof, thus reducing the number of inputs/outputs of the case.
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