发明名称 |
PROCEDE DE FABRICATION COLLECTIVE DE DIODES HYPERFREQUENCE AVEC ENCAPSULATION INCORPOREE ET DIODES AINSI OBTENUES |
摘要 |
The invention relates to microwave frequency diodes and to their method of manufacture. The subject of the invention is a diode manufactured by a collective method in which the junction is inserted into two superimposed slices of dielectric 12 and 18 serving as encapsulation, avoiding the use of a package. Application in particular to avalanche diodes operating in the 94 GHz band. <IMAGE> |
申请公布号 |
FR2538616(B1) |
申请公布日期 |
1986.01.24 |
申请号 |
FR19820021873 |
申请日期 |
1982.12.28 |
申请人 |
THOMSON CSF |
发明人 |
MARIANNE BOUDOT, RAYMOND HENRY, MICHEL HEITZMANN ET CLAUDE CARRIERE |
分类号 |
H01L21/329;H01L21/78;H01L23/051;H01L23/31;(IPC1-7):H01L21/78;H01L29/86 |
主分类号 |
H01L21/329 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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