| 摘要 |
PURPOSE:To prevent peeling or the like in a packing, facilitate the replacement of a releasing material layer when it is worn, and to improve the reliability of the formed semiconductor device, by making detachable the mold sections whose cavity upper and bottom surfaces each having a releasing material attached thereto. CONSTITUTION:A top force 2 and a bottom force 3 are formed with a mold upper section 7 and a mold bottom section 8 that are detachable and slidable and are positioned inside of the ejector pins 6. A releasing material 9 of a fluorine plastic (polytetrafluoroethylene) is attached to each of the surfaces forming a cavity 4 defined by the mold upper section 7 and the mold bottom section 8. When an assembled lead frame 10 is clamped in the molds, then the cavity 4 is filled for example with an epoxy resin fed from a gate 5 and the molding is effected, the removal of the package can be readily done at the package surfaces on and under the pellet, and therefore occurrence of peeling, cracking of the pellet or the like can be prevented. |
