Method of producing heat dissipation regions

摘要

The invention relates to the production of such regions on cards intended to receive electronic components. Heat dissipation regions are produced on a card 1 by using a resistive composition. Each region is localised through the configuration 2, 3, 4 given to this resistive composition. Each configuration has dimensions which determine the desired heat dissipation. The invention finds application in the simulation of heat dissipation due to electronic cards when they are in service in equipment. <IMAGE>