| 摘要 |
PURPOSE:To secure the satisfactory strength of connection between a lead pattern and a lead-out pattern of a thin film magnetic head, by fixing a metallic thin wire to the lead-out pattern tentatively with an ultrasonic welding and then finally press-fixing them with heat. CONSTITUTION:An Au wire 14 is fixed to an end part 12b at the other side of a lead pattern 12 like in the case of an Au wire 13. In other words, a Cu thin film having several tens mu thickness is used to the pattern 12 with the diameter of the wire 14 set at several tens mum. Then the light pressure is applied to these pattern and wire at a normal temperature and with addition of ultrasonic waves. A conduction pattern 6 uses an Sn film 6' of several mum thickness when the wire 14 is fixed to an end part 6a of the lead-out pattern 6. In this case, the pattern 6 is fixed tentatively to the wire 14 via ultrasonic waves like in the case of the wire 13. Thus the wire 14 is welded tentatively onto the part 6a of the pattern 6. Then the final fixing process is through by a press-fixing process with heat. In such a way, it is possible to eliminate the problems such as a connection short, etc. owing to a position shift when the pattern 6 of a flexible cable 8 is connected to the wire 14. |
