| 摘要 |
PURPOSE:To prevent the deterioration of a matching accuracy in case of a photoetching process of a large area element by heating or cooling one of a photomask or a substrate with respect to their relative expansion and contraction. CONSTITUTION:A photomask 5 is placed on a base 6, and fixed by sucking air with a pressure reducing means through an adsorbing hole 7. The base 6 is provided with an opening part 12, and ultraviolet rays 13 from a light source are irradiated to a photosensitive resin on a sample 10 after passing through the mask 5 and the opening part 12, and a mask pattern formed on one main surface of the mask 5 is transferred to the photosensitive resin. In this case, an exothermic or endothermic element 14 which contacts to the mask 5 is incorporated in the base 6. The element 14 is provided with an electric conduction wire or a pipe 15 for giving an exothermic or endothermic function and the element 14 is installed to the peripheral part of the mask 5. |
