| 摘要 |
PURPOSE:To obtain an apparatus and a method for resin-sealing a semiconductor device having high vacuum performance, a space conservation and high resin sealing performance by systematizing a vacuum evacuation passage and reducing a vacuum chamber volume. CONSTITUTION:An ejector chamber 100 surrounded by a lower mold chase 15, a lower mold ejector mechanism 17 and a frame 19 is vacuum-evacuated through a first vacuum evacuation passage 25. An ejector chamber 200 surrounded by an upper mold chase 31, an upper mold ejector mechanism 50 and a frame 51 is vacuum-evacuated through a second vacuum evacuation passage 37. A parting chamber 300 around parting surfaces is vacuum-evacuated through a third vacuum-evacuation passage 38. A volume to become vacuum chambers can be remarkably reduced, and efficiently vacuum-evacuated.
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