| 摘要 |
PURPOSE:To make it unnecessary to execute a contamination eliminating work by protecting a metallic film surface for soldering provided on a glass substrate, from oxidization and contamination, covering it with a metallic film of other kind which can execute etching removal by leaving said metallic film, and thereafter, covering it with a protective inorganic substance film. CONSTITUTION:A chromium film 7 having good adhesive strength is formed on a glass substrate 1 on which a pattern has been formed by a transparent conductive film, and a copper film 8 is covered on said film. Copper and chromium adhere tightly to each other, and the copper film 8 is adhered tightly to the glass substrate 1. The copper film 8 is covered with a chromium film 9 as a protective metallic film for preventing this film from being oxidized or contaminated. On said film, an LSI chip is soldered through a connecting solder 6. In this way, it becomes unnecessary to execute an oxide and contamination eliminating work on the surface of a soldered part, soldering is executed exactly, and the mass-productivity can be improved. |
