| 摘要 |
PURPOSE:To contrive the improvement in reliability by enhancing the moisture- resistant effect of the titled component by a method wherein the whole surface is coated with polyurethane resin, including a sintered type capacitor loaded on the main body of semiconductor IC component and lead electrodes. CONSTITUTION:A low-dielectric layer 2 is provided on the surface of a sintered type laminated capacitor 1, and a thick film resistor 3 is laminated on this surface. The capacitor 1 is connected to the resistor 3 with a conductive electrode 4, thus constructing a circuit block. This circuit block is loaded on the main body of the semiconductor IC component 5. Lead electrodes 6 led out of the IC component 5 are connected to the conductive electrode 4, and its connection 7 is bonded by soldering. The whole surface outside the main body of this composite component is provided with a protection film 8 of polyurethane resin. |
