Ic package and method of its manufacture

摘要

A package of surface mount type having a bump (30) on the surface of the substrate of the package as a connecting terminal. A through hole (15) provided through the substrate (10) is filled with electrical insulating paste (20). Part of the paste (20) is extruded from the through hole (15) in the form of a hemisphere and cured together with the paste (20) in the through hole (15) to form the bump (30).