POLISHING METHOD, POLISHING DEVICE, AND BODY TO BE POLISHED THEREFOR

摘要

PURPOSE:To enable a work to be accurately controlled in amount of polish by a method wherein a polishing process is controlled based on changes in mechanical vibrations produced due to friction between the work and a polishing body. CONSTITUTION:A ceramic sheet 7 which sucks and supports a wafer 4 by a suction pad 5 and a guide 6 is placed on a polishing cloth 3 which is pasted on the polishing body 2 containing abrasive agent. A piezoelectric device 8 is brought into contact with the ceramic sheet 7, and the piezoelectric device 8 and its vicinity are covered with a rubber member 9 which shuts off adventitious mechanical vibrations. A holding pierce 10 provided with a projection where an opening is bored at its center is placed on the rubber member 9, a weight 11 provided with an opening at its center is placed thereon to control a pressure applied between the wafer 4 and the polishing cloth 3, and electrical signals converted by the piezoelectric device 8 are transmitted to a frequency analyzer 12 through a signal line. The wafer 4 is controlled in thickness of polish on the basis of the frequency intensity distribution of mechanical vibration analyzed by the frequency analyzer 12, whereby an amount of polish can be controlled to an accuracy of the order of 1/10mum.