发明名称 WIRE BONDING METHOD
摘要 PURPOSE:To enable to bond on a thick film conductor in high reliability and to improve bonding productivity by managing the widths and the lengths of second bonds wired separately in the direction perpendicular to a supersonic horn shaft and in the axial direction of a horn. CONSTITUTION:In an Au fine thermosonic type wire bonding method to a thick film conductor, the ratio W of wire deforming width/wire diameter of the second connector wires to a perpendicular direction X-X direction X-X to a supersonic horn axis is 3.5<Wr<=4.5, and the ratio Lr of wire deforming width/wire diameter of horn axial direction Y-Y is 3.0<Lr<=3.5. The bonding strength ratio of X-X direction depends upon the deforming width. If the deforming width is small, the bonding is missed, or bond lift occurs, while if the deforming width is exessively large, the bonding strength extremely decreases. The bonding strength ratio of Y-Y axis depends upon the deforming length Lr, and tends to vary similar to X-X direction.
申请公布号 JPS6114732(A) 申请公布日期 1986.01.22
申请号 JP19840134855 申请日期 1984.06.29
申请人 TOSHIBA KK 发明人 WATANABE ZENSAKU;CHIYOMA HITOSHI;KIDA KUNIAKI
分类号 H01L21/607;H01L21/60;H01L21/603 主分类号 H01L21/607
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