WIRE BONDING METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCED BY THIS METHOD

摘要

A semiconductor device includes a semiconductor chip, a package for housing the semiconductor chip, and wires for bonding one of a plurality of electrodes formed on the semiconductor chip and one of a plurality of electrodes formed on the package. Each of the wires has a portion rising at a steep angle with respect to one of the electrodes to be bonded and a portion descending at a gentle angle with respect to the other of the electrodes to be bonded. The rising portion and the descending portion of each wire are disposed in reverse positions with respect to the rising portion and the descending portion of the adjacent wires.