| 摘要 |
PURPOSE:To improve the wire bondability and to standardize a lead frame of a semiconductor device by securing a circuit board to the back surface over the lower land of the frame and the lower end of the land, securing parts on the land and the board, and connecting by wire bonding. CONSTITUTION:A finely patterned lead frame 7 has a land 8 and many leads 9 extending from the vicinity of the land 8 and integrally coupled by a tamper 10. A circuit board 11 is bonded fixedly with an insulating adhesive 12 over the entire lower area of the land 8 and the lower surface of the ends 9' of the leads at the land side. The board 11 is coated with passive element pattern, wiring pattern, bonding pad, circuit element patterns 14a, 14b such as soldering lands in a thin film state on both front and back surfaces of an insulating board 13 such as silicon or plastic. Numeral 15 designates a semiconductor pellet for large power mounted on the land 8. |
