| 摘要 |
<p>PURPOSE:To form an alloy film having an approximately specified compsn. on an object to be treated by executing sputtering while changing the intensity of the magnetic field to be impressed to a target contg. different kinds of metals according to the depth of erosion or the factor associated thereto. CONSTITUTION:A magnetron sputtering device consists in disposing a stainless steel cylindrical cover 7 to the outside of concentrically disposed cylndrical coils 5, 6, disposed a mosaic target 3 arranged alternately with Mo plates 1 and Si plates 2 at a prescribed area ratio on the edge 7a at the end thereof, impressing a magnetic field to the surface of the target 3 from the above-mentioned coils 5, 6, executing sputtering under the influence of the magnetic field and forming the alloy film on a substrate 4 disposed to face the target 3. The intensity of said magnetic field with the above-mentioned sputtering device is changed by adjusting the current to be impressed to the coils 5, 6 according to the depth of the erosion of the target 3 or the factor such as the time for using the target associated to the depth of the erosion. The Mo-Si of the alloy film is thus maintained approximately at the uniform compsn.</p> |
