发明名称 |
COPPER FOIL FOR PRINTED CIRCUIT AND METHOD OF PRODUCING SAME |
摘要 |
A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates. |
申请公布号 |
JPS6113688(A) |
申请公布日期 |
1986.01.21 |
申请号 |
JP19840134923 |
申请日期 |
1984.06.28 |
申请人 |
FUKUDA KINZOKU HAKUFUN KOGYO KK |
发明人 |
TAKAMI MASATO |
分类号 |
B32B15/08;C23C22/24;C25D3/56;H05K1/09;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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