| 摘要 |
PURPOSE:To enable to firmly carry out a connection between the electrodes provided extendedly onto a resin for adhesion to the substrate and conductor wires by a method wherein an Si compound is arranged between at least the electrodes of the compound semiconductor and the resin. CONSTITUTION:A compound semiconductor piece 50 is etched to a constant depth, and the semiconductor piece 50 is covered with an SiO2 film 42 and is adhered on a substrate 24 using a resin 25 for bonding. The back surface of the piece 50 is polished and elements 26 and 27 are formed. Then, the elements 26 and 27 are respectively provided with a lead-out electrode 40 and a lead-out electrode 41, which are extendedly provided to the resin 25, and a unit 23 is completed. Each one end 31'c of conductor wires 31'a and 31'b, by which the electrodes of the elements 26 and 27 and each one end of printed wirings 28b on substrates 28 are mutually connected, is made a nailhead-junction to the substrates 28 and the other ends 31'd of the conductor wires 31' and 31'b are made a stitch junction to the lead-out electrodes 40 and 41. As the SiO2 film 42 is being made to interpose between the resin 25 and the electrodes 40 and 41, the junction parts are reinforced by the SiO2 film 42 at the time of stitch junction and can be sufficiently pressed, the conductor wires 31'a and 31'b can be connected to the electrodes 40 and 41 making sufficient strength hold on the electrodes 40 and 41, and moreover, stress is never applied on the elements 26 and 27 and no crack is generated. |
