| 摘要 |
PURPOSE:To provide a titled device which decreases the deposition speed of sputtering atoms to a metallic retainer which grips and fixes the end of the surface to be sputtered of a target material to an electrode and improves working efficiency by tapering the collar of said retainer toward the surface to be sputtered. CONSTITUTION:A supporting device for a sputtering target is provided with the metallic retainer 10 which grips and fixed the target material 4 to be used for sputtering to the electrode 1 freely attachably and detachably by means of bolts 3. The collar 10a of the retainer 10 which grips and fixes the end of the surface 4a to be sputtered of the material 4 in such device is tapered 10b toward the surface 4a. The taper angle theta of the part 10b is preferably about 30 deg.. The deposition speed of the sputtering atoms generated from the surface 4a to the collar 10a is considerably decreased by the above-mentioned constitution. The cleaning cycle of the supporting device is thus extended and the working efficiency of the sputtering device is improved. |
