| 摘要 |
The compounds according to the invention have the formula XIX <IMAGE> (XIX) in which R1 and R2 are independently methyl, ethyl, phenyl, vinyl, chlorine or alkoxy, R3 is chlorine or alkoxy, A1 is alkylene and Y is substituted ethenylene. These products are to be used as adhesion promoters, especially between inorganic solids and organic resins. 4 processes of preparation are given.
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