| 摘要 |
PURPOSE:To prevent a contact trouble of Si at the shoulder parts of a chip and a fine metal wire by a method wherein the shoulder parts are covered with a photosensitive and insulative resin. CONSTITUTION:The surface of an Si wafer is covered with a photosensitive and insulative resin 10, and after that, the surface is patternized in such a way that the parts between junction pads 3 adjacent to scratch grooves 5 in the isolation boundary parts are left and is divided. According to this constitution, the possibility that Si at the shoulder parts of a chip is brought into contact with a fine metal wire is reduced and an inspection that is needed after a connection of the fine metal wire in the conventional constitution can be omitted. |
