| 摘要 |
PURPOSE:To form a large number of the titled packages simultaneously at low cost by laminating a plurality of ceramic green sheets, to which spaces and notch sections are shaped, while cutting the sheets so that through-holes are formed to side surfaces. CONSTITUTION:Spaces A for housing optical semiconductor elements are shaped to ceramic green sheets 10a, 10d, and spaces B for housing the optical semiconductor elements and notch sections C for through-holes, through which optical fibers are inserted into the spaces B, are formed to ceramic green sheets 10b, 10c. These sheets 10a-10c are positioned and laminated onto the ceramic green sheet 10d in succession, and hot-pressed. The laminate of the ceramic green sheets is cut along the outer circumferential sections of the spaces A, B so that the through-holes are shaped to side surfaces. Accordingly, a recessed section formed to the inside and the outside are communicated through the through-hole H in the cut laminate, and an optical fiber can be inserted into the internal recessed section of the laminate 11 from the outside. |
