| 摘要 |
PURPOSE:To flatten a coil forming surface so that a fine thin film coil can be formed with good accuracy by forming a resin insulating layer for correcting a step having the thickness approximately equal to the thickness of a lower magnetic pole layer in the region on a substrate corresponding to the region intended for forming the thin film coil except the part above the lower magnetic layer and forming further a resin insulating layer thereon. CONSTITUTION:A resist film 23 is formed by a spin coating method using a resist material, etc. for thickness on the lower magnetic pole layer 13 except the top end part of the magnetic pole and the resin insulating layer for correcting the step consisting of the 1st and 2nd resin insulating layers 21, 22. The film 23 is patterned to a prescribed pattern by a photolithography method. The resin insulating layer made into the 3-layered construction having the flat surface for forming the thin is thus easily formed. The thin film coil is thus formed with good accuracy if the thin film coil 25 consisting of a copper (Cu) conductive film is formed by a so-called mask plating method on the 3rd resin insulating layer 24 having the flat surface for forming the thin film coil. |
