发明名称 DEVICE FOR MANUFACTURING SEMICONDUCTOR LEAD FRAME
摘要 PURPOSE:To improve the operating efficiency of the pressing machine, the productibity, and the economy by enabling the supply of lead frames of stable quality by a method wherein the roller section having a required coining shape is arranged between the feeding means for a metallic material and the pressing section for pressing work. CONSTITUTION:The metallic material 10 is fed out of an uncoiler 11 into a pressing device 13 by correcting the flatness, etc. with a material leveler 12. The metallic material 10 fed into the pressing device 13 is carried into a metal mold 16 by a carrier roller 15 every required lengths. This material 10 is successively coined between the lower roller 18 by the rotation transmitted from the carrier roller 15 via gear 19 in the roller section at the step prior to the metal mold 16; further, its warps generating during coining and its flatness are corrected. Then, a semiconductor lead frame formed by pressing work with the metal mold 16 is corrected by the leveler 14 in warps and the like generating during pressing work; thereafter, the semiconductor lead frame and the semiconductor device complete.
申请公布号 JPS6110262(A) 申请公布日期 1986.01.17
申请号 JP19840130119 申请日期 1984.06.26
申请人 TOSHIBA KK 发明人 DOI HATSUO
分类号 H01L23/48;H01L21/00 主分类号 H01L23/48
代理机构 代理人
主权项
地址