发明名称 FORMATION OF BUMP
摘要 PURPOSE:To obtain a simple method for thickening both sides of the narrow part by keeping the micro dimensions of this part by a method wherein a substrate is coated with a metallic thin film, and a metal pattern having the narrow part in the midde is formed by patterning this metallic thin film; then, the narrow part is fused by passing current to this metal pattern in vacuum. CONSTITUTION:The substrate 1 is coated with resist 9, which is then patterned into a shape of micro bridge of 5,000Angstrom length and width at the narrow part by means of electron ray exposure. Next, a superconductive Pb thin film 1,000Angstrom thick is evaporated as the metallic thin film 2, and bumps 7 and 8 are formed by fusing the narrow part with the flow of 0.5A step current to the narrow part in a vacuum of 5X10<-6>. Then, a superconductive Pb thin film 1,000Angstrom thick is evaporated as the metallic thin film 10 by covering the micro bridge part, and the metallic thin film 10 on the resist 9 is lifted off, when a micro bridge as shown by the drawing can be obtained.
申请公布号 JPS6110286(A) 申请公布日期 1986.01.17
申请号 JP19840131706 申请日期 1984.06.26
申请人 FUJITSU KK 发明人 KOBAYASHI MASANORI;WADA KUNIHIKO
分类号 H01L39/24 主分类号 H01L39/24
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