| 摘要 |
PURPOSE:To shorten the feature extracting time when a wafer is positioned with a semiconductor producer by detecting first the feature information in a macroscopically and then limiting a part of the feature information to magnify it microscopically to detect a position having a feature. CONSTITUTION:Light emitted from a light source 7 irradiates the surface A of a wafer through a lens 6, and the reflected light sent from a macroscopic area is made incident on an image pickup camera 1 through a mirror 5, a lens 4, a mirror 3 and a beam splitter 2. An area pattern of the surface A is compared with the data already recorded as the basic recognition information. Then a feature part is selected. A mounting stand of the wafer is shifted 2-dimensionally for the microscopic detection of a surface detected macroscopically. Then the reflected light sent from a microscopic area B is magnified by a lens 11 and made incident on the camera 1 through mirrors 10 and 9, a lens 8 and the splitter 2. A masking plate 21 is driven to switch the macroscopic information to the microscopic information. |
