| 摘要 |
An electronic circuit mount (1), for semi-conductor chips, has a series of closed-bottomed recesses (2) within the thickness (t) of the mount, with each recess opening to a surface (3) of the mount and being shaped to house a semi-conductor chip (9) of given configuration; the amount having an applied pattern (6) of chip-interconnecting electrical conductors (7) extending over the mount and to each recess; the mount being moulded from thermoplastic material and each recess having means (4, 10) for conducting away and dissipating heat therefrom. In use, the heat conducting and dissipating means convey heat generated by a chip away from the recess it is mounted in and prevents the thermoplastic of the mount in the area of the recess from degrading. |
