| 摘要 |
PURPOSE:To prevent the outflow of a casting resin to the outside of a sealed region, to hold the resin in a limited region stably and to make it possible to perform high density mounting, by surrounding the sealed region by the casting resin by a tape carrier, whose surface energy is small. CONSTITUTION:A circuit substrate 5 is connected to the electrode part of a pellet 3 by a wire 6 and also connected to a lead pin 2 through a wiring 7 in an external wiring substrate 1. A connector bump 8 is provided at the outer region of the wire attaching part of the circuit substrate 5. A tape carrier 9, which is made of a material whose surface energy is small, is provided on the connector bump 8 in parallel with the circuit substrate 5. The entire body or at least the surface of the tape carrier 9 comprises a material, whose surface energy is small, e.g., fluorine or silicon resin. The bonding property of the material with other materials is less. In a region surrounded by the connector bump 8 and the tape carrier 9, a casting resin 10 is provided so as to seal the pellet 3, the wire 6 and the like. |
