| 摘要 |
PURPOSE:To make the stopping time of bending work short and to improve productivity, by bending the lead terminals of a semiconductor device only by bending rolls at the lower side by lowering a supporting member, freeing upper rolls, and lowering the lower descending limit of the upper rolls when the operating limit of the lower rolls is reached. CONSTITUTION:Lower stoppers 25 are attached on a die plate 5. A press machine is actuated and a punch plate 7 is lowered. The bases of many lead terminals are pushed by both protruded parts 11a of a pushing plate 11. The punch plate 7 is lowered, and the lead terminals 2 on both sides are bent by lower bending rolls 10. At this time, upper stoppers 26 are contacted with the lower stoppers 25, and the descent is restricted. Upper bending rollers 24 are located at positions, which are not contacted with the lead terminals 2, and are made idle. Then the punch plate 7 is lifted. In this way, the bending of the lead terminals 2 of many semiconductor devices 4 is performed, and abrasion of the lower bending roller 24 and supporting pins 9 progresses. When the allowance limit of insufficient bending of the lead terminals is approached, the lower stoppers 25 are removed. |
