METHOD OF FORMING RAISED METALLIC CONTACTS ON ELECTRICAL CIRCUITS FOR PERMANENT BONDING

摘要

A method is provided for forming at least one raised metallic contact on an electrical circuit for permanent bonding. Generally, this method includes the following steps: providing a composite base substrate (10) which is defined by at least a first conductive layer (12), a dielectric material (14) and a second conductive layer (16); removing a predetermined portion (20) of the first conductive layer (12) to expose the dielectric material (14); removing the exposed portion (22) of the dielectric material (14) to the second conductive layer (16), thereby forming a depression (24); depositing at least one layer of solder (60) on at least side wall portions of the depression (24); depositing at least one layer of copper (63); removing the second conductive layer (16); and removing the dielectric material (14) thereby forming a raised solder contact (70) which extends perpendicularly away from the first conductive layer (12).