| 摘要 |
PURPOSE:To improve yield, reduce process, and increase workability by impregnating a substrate in which an etching protective coat is formed at a through- hole section and the connection of each electrode with the etching liquid that reacts to the material of a conductor wiring layer. CONSTITUTION:An Al coat is formed on a glass substrate 1 and then a conductor wiring layer 2 is formed. In addition, an insulating layer 3 is formed on a section that connects and fixes a filament, grid, etc. on a surface including a conductor wiring layer 2 to the conductor wiring layer 2 and that excludes a through-hole section 4. Subsequently, after a resist coat 6 is formed on all surfaces of a substrate, the resist coat 6 is removed using a photo mask with the same insulating layer formation pattern and for only the section on which the insulating layer 3 is not formed, the resist coat 6 is left behind as an etching protective coat. In addition, by impregnating the substrate with the etching liquid that reacts to tha material of the conductor wiring layer 2, a section just under a pinhole 5 is etched and a hollow section 21 can be obtained. Then, after the remaining resist coat is removed, a conductor layer for display segments is formed. |
