| 摘要 |
Disclosed is a wire enamel blend which is curable to the B-stage with UV light then to the C stage with heat. The blend comprises up to about 40% of an acrylated epoxy dissolved in a monoacrylate, about 2 to about 26% of an acrylated polybutadiene, about 3 to about 26% of an acrylated polyester-amide-imide dissolved in a monoacrylate and in an unsatured diester, about 30 to about 65% of an end-blocked urethane dissolved in a monoacrylate and hydroxy terminated unsaturated diesters, up to about 15% of a cresol formaldehyde dissolved in monoacrylates, about 1.5 to about 5% of a UV photoinitiator, up to about 5% of an acrylated methoxymethyl melamine, and up to about 0.1% of a flow control agent. |
