| 摘要 |
PURPOSE:To improve heat dissipation, and to manufacture a circuit substrate at low cost by using a ceramics board body having thermal conductivity better than alumina and an alumina group ceramics board body as an insulating substrate for a semiconductor module. CONSTITUTION:An aluminum nitride group ceramics substrate 6 having thermal conductivity better than alumina at a position corresponding to the loading section of a semiconductor element 3 and alumina group ceramics substrates 1 at sections except said position are bonded directly with a metallic plate 5. Circuit patterns 2a, 2b are bonded directly with other surfaces of each of these ceramics substrates. The element and other electric circuits 2b are connected by bonding wires 4. The heat-dissipating properties of the circuit substrate for semiconductors formed in this manner are made better than those of semiconductor substrates using only alumina group ceramics substrates as insulating plates by approximately one and a half times. |
