| 摘要 |
An integrated circuit device cooling structure includes a wiring substrate (5), an integrated circuit device (1), a heat sink (9), and heat radiation vias (7). The integrated circuit device is mounted on the first surface side of the wiring substrate (5). The heat sink (9) is fixed to the second surface of the wiring substrate and thermally coupled to the wiring substrate. The heat radiation vias (7) are formed in the wiring substrate (5) to transmit heat generated by the integrated circuit device (1) to the heat sink. <IMAGE> |
