| 摘要 |
PURPOSE:To change wirings simply by fixing additional pads onto a substrate in the vicinity of each chip part requiring the alteration of connections and connecting the additional pads by additional wirings. CONSTITUTION:When it is confirmed that a conduction between an IC chip 4a and a wiring 1 is released and terminals for IC chips 4a and 4b must be conducted in place of said conduction, an additional pad 10 is fitted at a position in the vicinity of terminals for the chip 4a on a ceramic multilayer substrate 2. One tip of a bonding wire 5b is removed from a bonding pad 3b, and connected onto the pad 10, and an additional wiring 11 is wired between the pad 10 and a bonding bad 3d. According to the changing method, wirings can be altered simply without replacing the ceramic multilayer substrate. |
