| 摘要 |
PURPOSE:To prevent the short circuit of a P-N junction on soldering by bonding a semiconductor wafer with a sub-substrate having a larger area before pellets are cut out of the wafer and bonding pieces obtained by cutting out pellets together with the sub-substrate with a main substrate. CONSTITUTION:An anode electrode 4 on the back of a wafer 11 to which a plurality of pellets 1, 1 which must be uct out, are formed is bonded with a sub- substrate 2 having the same area as the wafer 11 by solder. The pellets 1 are cut out together with the sub-substrates 2 from the wafer 11, and the pellets 1 are soldered to main substrates 3, thus completing devices. Solder on the soldering does not reach to a P-N junction 10 by the thickness of the sub-substrate 2 even when solder overflows. |
