| 摘要 |
PURPOSE:To enhance conductor occupation coefficient by eliminating a metal layer not covered with a photosensitive material through the etching after formation of pattern, and by narrowing an etching width, enhancing accuracy of conductor width, conductor thickness and narrowing interval between conductors through the metal plating process under the condition that the photosensitive material is left. CONSTITUTION:An eddy-shaped predetermined pattern 3 is formed with a photosensitive material on a base material which is formed on an insulated base material 1 allowing formation of a metal layer 2 such as copper foil. Next, the metal layer 2 not covered with the photosensitive material is eliminated by the etching and thereby the metal layer is side-etched. Thereafter, metal is precipitated to the side-etched area through the metal plating process in order to form the repaired metal part 4. As an insulating base material which forms a sheet coil, for example, there is a film or plate consisting of the acrylic thermoplastic resin or phenolic thermosetting resin and it is desirable to use a material having as much insulation property as possible. Moreover, the insulating base material should be as thin as possible and desirable thickness is about 2-100mum. |
